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The BMS-1000 Bond Measurement System from Ultrasonic Arrays is a non-contact, on-line system for measuring the bond integrity of plywood and other engineered wood panels and detecting internal defects such as blisters, blows, and delaminations. By transmitting high-frequency ultrasound continuously through a product and processing the signal, decisions can be made regarding the panel's strength and the quality of the production run. Finding internal defects optimizes press operation because manufacturers can rely on the BMS to find real defects and to ensure that only high-quality panels ship to the customer. Because internal defects are invisible to the eye, the BMS is essential to controlling the process.
Measurements taken by conventional blow detectors are affected by factors other than blows or blisters. The measurements taken by Ultrasonic Arrays' Bond Measurement System are not affected by environmental or process conditions such as saw noise, surface texture, dust, wood chips, wood species, water vapor, moisture content or temperature. UAI's measurement method and algorithms separate variables, such as changing wood species, moisture content, density, environment, and sensor variation from the measurement, leaving only actual defects as the remaining variable. Panel temperature variation will cause good panels to be rejected while accepting blown panels. The BMS-1000 measures panel temperature while grading to correct for panel temperature error.
UAI gages can be used as stand alone systems and do not require a computer. Individual gages are microprocessor controlled and are programmed via a keypad and display. All functionality is available in the BMS-1000 controller, accessed by a 24 position keypad. Optional Measuremate software and computer provides full graphics, remote product selection and NET DDE/OLE/OPC. When used with Measuremate, full synchronization between BMS controller and computer is provided.
